Heat Transfer simulation tasks

Heat transfer enhancement for heat exchanger elements

Heat transfer enhancement for heat exchanger elements
Experiment at Re=15 000
	Comparison of oval-shaped cylinders with circular ones	Modeling

Heat transfer enhancement for LED
		Conjugated problem of heat removal from LED Heat removal system contains heat pipes Used software: Ansys Fluent 14.5
	Source Power = 90 Wt Ambient T = 295 K Heat pipe thermal cond. =25000 Wt/mK	Temperature distribution at the heat removal system surface
	Heat wake above LED heat removal system

Thermal regime of control system microelement of car generator
Surface of: chip – 5x5 mm, copper substrate – 8x8 mm, ceramic substrate – 15x15 mm, Al thermal sink – 25x30 mm	Boundary conditions: Heat power of the chip – 3 Wt, Inlet air velocity – 5 m/s, Inlet air temperature – 398 K, Inlet turbulence level – 10% Used software: Ansys Fluent 14.5

Thermal regime of control system microelement of car generator

Q.: Which of the variants gives a minimal chip temperature?

Thermal regime of control system microelement of car generator

Variant 1: Copper – 7x7 mm, copper λ=150 Wt/(m K), adhesive λ=0.88 Wt/(m K)
Variant 2: Copper – 7x7 mm, change in ceramics Al2O3 to Al with grade AD0 (ρ=2710 kg/m3, λ=202.4 Wt/(m K), сp=930 J/(kg K)); copper λ=380 Wt/(m K), adhesive λ=1.68 Wt/(m K)

Energy saving device ‘Turbosphere’ for electricity production

	3D problem using the CAD model close to a real device Unsteady RANS equations, SST–k–ω turbulence model, upwind scheme, SIMPLEС algorithm Used software: Ansys Fluent 15.0
CAD-model ‘Turbosphere’	Temperature distribution in the gas pipeline	Streamlines near blades